SEMI 3D & Systems Summit 2023 | SEMI Europe | 25 June 2023 | Hilton Dresden, An d. Frauenkirche 5, 01067 Dresden, Germany

This events had several changes in market, products, and tech advancements brought by disruptive technologies and Moore's Law plateauing. Therefore, continued developments and innovation are essential to growing the business.

Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies.

2023 Speakers

PANELISTS:

Raja Swaminathan
Corporate Vice President, AMD

André Blum
Project Manager, Progressive Semiconductor Program, Audi AG

Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program, imec

SPEAKERS:

Laith Altimime
President, SEMI Europe

Eric Fribourg-Blanc
Program Officer, European Commission

Chris Jones
Senior Director, PVD Product Management, SPTS Technologies Ltd, a KLA company

Emilie Jolivet
Director of the Semiconductor, Memory & Computing Division, Yole Group

Michelle Williams-Vaden
Deputy Director, SEMI Foundation

Jan Vardaman
President, TechSearch International, Inc

Steven Steen
Head of Product Management, Process Window Control Applications, ASML

Rozalia Beica
VP Strategic Marketing & Business Development, Microelectronics Business Unit, AT&S China

Moyra Mc Manus
Director, Source and Procure, ASML

Sheng Wang
Strategic Business Development Manager, ASML

Isabella Drolz
VP Product Marketing, Comet Yxlon

Thomas Uhrmann
Director of Business Development, EV Group

Emmanuel OllierEmmanuel Ollier
Head of the Laboratory of 3D Integration Technologies, CEA-Leti

Keith Buchanan
Senior Product Manager, PECVD, KLA Corporation (SPTS Division)

Wing-Shan Ribi Leung
Senior Manager of Operations and Applications, KLA Corporation (LS-SWIFT Division)

Ralf Schmidt
R&D Manager Semiconductor

Giorgio Cellere
Product Management, Advanced Packaging, Applied Materials

Jonathan Abdilla
Director Technical Marketing, Besi

Anthony Philippe
Research Engineer, CEA-Leti

Yoan Dupret
Managing Director and CTO, Menta

Seung Kang
Vice President of Strategy, Adeia, Inc.

Andy Heinig
Head of Department Efficient Electronics, Fraunhofer IIS-EAS

Michael Dittrich
Team Lead for IC Packaging, Racyics GmbH

Heiko Dudek
Business Development, Siemens EDA

Vikas Gupta
Director, Engineering & Technical Marketing, ASE, Inc.

Ivan Nikitski
Technology Manager, EPIC

Tolga Tekin
Group Manager, Fraunhofer IZM

Natarajan Rajasekaran
R&D Engineer of 3D and Silicon Photonics Technologies Department, Imec

Daniel Lieske
Senior Expert Advanced Packaging, AEMtec GmbH

Dirk Hilbert
Mayor, Dresden City Council

Pascal Metzger
CEO, SET Corporation S.A.

Luc Augustin
CTO, Smart Photonics

Markus Wimplinger
Corporate Technology Development and IP Director, EV Group

Herbert Oetzlinger
CEO, SEMSYSCO, a Lam Research company

Anne Jourdain
Principal Member of Technical Staff, Team Lead 3D Heterogeneous Integration, imec

Roland Rettenmeier
Product Marketing and Business Development

Michael Töpper
Senior Expert Heterointegration, Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics

Thomas Schmidt
Product Manager Bonder, SÜSS MicroTec

2023 Sponsors

PLATINUM:
• Adeia
• ASE
• Comet
• Evatec
• Kla

GOLD:
• Racyics
• Suss Microtec

SILVER:
• Lam