1st Gen Enhancements Special Interest Meeting 2019 | EMVCo | 19 June 2019 | Prague, Czech Republic
Venue
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| Event Date |
Thu Jun 20 CEST (over 5 years ago)
In your timezone (EST): Wed Jun 19 6:00pm - Thu Jun 20 5:00pm |
| Location | Prague, Czech Republic |
| Region | EMEA |
Details
EMVCo exists to facilitate worldwide interoperability and acceptance of secure payment transactions. It accomplishes this by managing and evolving the EMV® Specifications and related testing processes. This includes, but is not limited to, card and terminal evaluation, security evaluation, and management of interoperability issues. Today there are EMV® Specifications based on contact chip, contactless chip, EMV® 2nd Generation, Common Payment Application (CPA), card personalisation, Payment Tokenisation, and 3-D Secure. Click here to watch a Webcast overview of the role of EMVCo in secure payments, and insight into the technical body’s latest initiatives; including EMV® Payment Tokenisation v2.0, EMV® 3-D Secure, EMV® QR Code and EMV® Secure Remote Commerce. Also, download the infographic, and 2018: A Year In Review, for insight into the EMVCo Associates Programme, an overview of EMVCo technologies and the latest worldwide EMV® Chip deployment statistics.