Optical Compute Interconnect: Co-packaged optics for AI infrastructure 2025 | Endeavor Business Media | 22 April 2025 | Webinars

Discover how Intel's groundbreaking Silicon Photonics technology and co-packaged optical I/O are revolutionizing AI infrastructure, enabling unprecedented bandwidth, energy efficiency, and scalability for next-gen compute solutions.

Future scale-up fabrics for AI infrastructure will require exponential increases in I/O bandwidth and extended connectivity. Co-packaged optical I/O can support this bandwidth requirement with higher bandwidth density, improved energy efficiency, low latency, and longer reach.

This webinar session describes Silicon Photonics as an enabling technology for the bandwidth growth with increased component integration, proven field reliability, and scalable manufacturing processes. It also covers Intel’s 4 Tbps Optical Compute Interconnect (OCI) chiplet, based on Intel in-house Silicon Photonics technology and co-packaged with next-generation CPU/GPU or other SOCs, as well as the path to 32 Tbps chiplets and beyond.

The OCI chiplet combines a single Silicon Photonics Integrated Circuit (PIC) with integrated on-chip lasers and optical amplifiers (SOA), with an electrical IC. At OFC 2024, Intel demonstrated our first OCI chiplet design co-packaged with a concept Intel CPU running an error-free CPU-to-CPU link over fiber.work, showcase benchmarks against classical HPC technologies, and demonstrate how this new approach can help organizations tackle compute-intensive problems.

2025 Speaker

Thomas Liljeberg
Sr. Director of Product Management and Strategy, Intel Corporation

2025 Sponsors

• Aerotech
• PI