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Event Date |
Tue Nov 14 EET - Fri Nov 17 EET (about 1 year ago)
In your timezone (EST): Mon Nov 13 5:00pm - Thu Nov 16 5:00pm |
Location |
Messe München Gmbh
Am Messesee 2, 81829 München, Germany |
Region | EMEA |
The event is creating the strongest single event for electronics manufacturing and broadening the range of attendees across the electronics chain. Learn how to overcome supply chain disruption and plan sustainably for delivering quality products and services to global players.
Why you should attend:
• Top-notch Keynotes
• Market Trends
• Exhibition
• Networking
• Advanced Packaging Forum / Fab Management Forum
• Sustainability
• Smart Manufacturing / Mobility / MedTech
• Workforce Development and many more!
Who should attend:
• Assembly & Test
• Components
• Design
• Fabless
• Flexible Hybrid Electronics (FHE)
• IC Device Applications
• IoT and Consumer Electronics Manufacturers
• Manufacturing Equipment
• Materials
• Micro-Electromechanical System (MEMS)
• Packaging
• Sensors
• Systems Integrators
• Business Managers
• College/Graduate Students
• Engineers
• Environment, Health & Safety (EH&S)
• Executives
• Field Services
• Managers
• Marketing & Sales
• Quality Assurance/Quality Control (QA/QC)
• Scientists
• Supply Chain
• Technicians
2023 Speakers
Andreas Grassmann
Vice President, Infineon Technologies
Anssi Salmela
Chief Technical Operations Officer | Principal Scientist, Bluefors
Benjamin Sokolowski
Managing Director & VP Government Affairs EMEA, Qualcomm
Berthold Hellenthal
Management Position, AUDI AG
Bill Lussier
Vice President, Regional Sales Europe, TEL
Christine Pelissier
General Manager, Customer Center EMEA, Edwards
Christoph Kutter
Executive Director, Fraunhofer EMFT
Christoph Schell
Executive Vice President and Chief Commercial Officer, Intel
Dionys van de Ven
President, Comet Yxlon
Douglas Yu
Vice President, TSMC
Fabien Chêne
VP Sustainability Solutions, Schneider Electric
Frederic Godemel
Executive VP, Schneider Electric
Jean-Marc Girard
CTO and SVP of Manufacturing Technologies, Air Liquide Advanced Materials
Karna Nisewaner
Corporate VP, General Counsel & Corporate Secretary, Cadence
Koen Lauwers
President Semiconductor Division, Edwards
Luc Van den hove
President and CEO, imec
Michaël Fievre
Vice President SOI operations in France, Soitec
Michael Schmid
Head of Strategic Semiconductor Management, Volkswagen
Missy Stigall
SVP of Operations, Wolfspeed
Neill Reynolds
Chief Financial Officer, Wolfspeed
Oreste Donzella
Executive VP, KLA
Paul de Bot
General Manager, TSMC
Pieter Dumon
Co-founder and CTO, Luceda Photonics
Ralf Montino
VP PLI, Elmos
Rebecca Dobson
Corporate Vice President EMEA, Cadence
Robert Franke
Managing Director, Investment and Marketing Corporation Saxony-Anhalt
Rutger Wijburg
Chief Operations Officer, Infineon Technologies
Sébastien Dauvé
CEO, CEA-Leti
Stefan Lutter
Vice President R&D, SUSS MicroTec
Stephan Haferl
CEO, Comet
2023 Sponsors
PLATINUM SPONSORS:
• Cadence
• Global Now
• Koh Young Europe GmbH
• Macquarie NEW
• TEL
GOLD SPONSORS:
• Comet Yxlon
• Edwards Vacuum
• Exyte
• KLA Logo
• Resonac
• Schneider Electric
SILVER SPONSORS:
• Evatec
• Invest in Pomerania + Disclaimer
• Microchip USA
• Semilab
• soitec
• SÜSS MicroTec
• Zeiss
EVENT SPONSORS:
• ASE
• Atotech 2022
• Atreg
• Beneq
• CI SEMI
• DB
• Ebara
• Entegris
• EVG EV Group
• flexciton
• Huawei
• imec
• Inficon
• LAM Midnight
• Merck no border
• NXP Semiconductors
• Panasonic Connect
• PhotonDelta
• Sachsen-Anhalt
• Samsung
• SCREEN 80 V2
• Synopsys
• Vat
• Watlow