Venue
Shanghai New International Expo Center
Shanghai New International Expo Center, China, Shanghai, Pudong, 龙阳路2345号 邮政编码: 201204

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Event Date Wed Mar 20 JST - Fri Mar 22 JST (9 months ago)
In your timezone (EST): Tue Mar 19 11:00am - Thu Mar 21 11:00am
Location Shanghai New International Expo Center
China, Shanghai, Pudong, 龙阳路2345号 邮政编码: 201204
Region APAC
Details

This event connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.
SEMI connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Speakers

2024 Speakers

Nanxiang Chen
Chairman, China Semiconductor Industry Association

Yanshun Chen
Chairman & Chairman of Executive Committee, BOE Technology Group

Anirudh Devgan
President & Chief Executive Officer, Cadence

Jinrong Zhao
Chairman, NAURA Technology Group Co., Ltd.

Qiwei Ren
Executive Vice President of TSINGHUA UNIGROUP, CEO of UNISOC

Sang Ho Kang
Vice President and General Manager of Semiconductor Technologies, DuPont

Wei Shaojun
Professor of Tsinghua University

Clark Tseng
Senior Director, SEMI

Ye Tianchun
Secretary General, China Integrated Circuit Innovation Alliance

Sponsors & Partners

2024 Sponsors

• Lam
• Applied Materials
• Tel
• Hanmi
• Jipal
• Screen
• Naura
• Edwards
• Cadence®
• Acm
• Research
• Huawei
• Klah
• Siemens
• Hwatsing
• Micron
• Aixtron
• Prosperity Investment
• Skyverse
• Schneider Electric
• AMEC
• IC Management
• Fujifilm
• CESE
• IKAS
• Life Augmented
• SINO IC Leasing
• Park Systems
• Aspiring
• Teradyne
• DKEM
• Quick
• Future Fab AI
• ThermoFisher
• Exyte
• Bain&Company
• RightLeder
• Coherent
• Megarobo
• HSET
• Supermag
• Jingan Mehanics
• Fullcryo
• DSIC
• Felton
• Yuweitek
• HLMC
• Esky Purify
• Conprofe
• QuiYe Purification
• CEEDI
• Gazer
• Heraeus
• Ideaoptics
• LSTD
• Xfab
• Zooming
• Gyro
• Lasertec
• MOOV
• Panasonic
• Aim Systems
• Grikin
• Yibu Semi
• Vulcan
• Shengjian Environment
• SRI
• Cameca
• Gomore
• Onto
• JSSI
• Sitri
• SYENSQO
• Axcelis
• Trelleborg
• ASM
• Gona-Semi
• Evergrand
• Leuven
• UniSic
• FA Softwware
• SAMT
• ANJI
• TMEIC